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to learn more about on semiconductor, please visit our website at www.onsemi.com please note: as part of the fairchild semiconductor integration, some of the fairchild orderable part numbers will need to change in order to meet on semiconductors system requirements. since the on semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the fairchild part numbers will be changed to a dash (-). this document may contain device numbers with an underscore (_). please check the on semiconductor website to verify the updated device numbers. the most current and up-to-date ordering information can be found at www.onsemi.com . please email any questions regarding the system integration to fairchild_questions@onsemi.com . is now part of on semiconductor and the on semiconductor logo are trademarks of semico nductor components industries, llc dba on semiconductor or its subsid iaries in the united states and/or other countries. on semiconductor ow ns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellec tual property. a listing of on semiconductor?s product/patent cover age may be accessed at www.onsemi.com/site/pdf/patent-marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semicon ductor makes no warranty, representation or guarantee regarding the s uitability of its products for any particular purpose, nor does on semico nductor assume any liability arising out of the application or use of any product or circuit, and speci?ca lly disclaims any and all liability, including without limitation spe cial, consequential or incidental damages. buyer is responsible for i ts products and applications using on semiconductor products, including compliance with all laws, regul ations and safety requirements or standards, regardless of any suppor t or applications information provided by on semiconductor. ?typica l? parameters which may be provided in on semiconductor data sheets and/or speci?cations can and do vary in diffe rent applications and actual performance may vary over time. all operat ing parameters, including ?typicals? must be validated for each custo mer application by customer?s technical experts. on semiconductor does not convey any license und er its patent rights nor the rights of others. on semiconductor products a re not designed, intended, or authorized for use as a critical compone nt in life support systems or any fda class 3 medical devices or medical devices with a same or similar classi?ca tion in a foreign jurisdiction or any devices intended for implantation i n the human body. should buyer purchase or use on semiconductor products fo r any such unintended or unauthorized application, buyer shall indemnify and hold on semico nductor and its of?cers, employees, subsidiaries, af?liates, and di stributors harmless against all claims, costs, damages, and expense s, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associa ted with such unintended or unauthorized use, even if such claim alleges th at on semiconductor was negligent regarding the design or manufacture o f the part. on semiconductor is an equal opportunity/af?rmative action employer. this literatu re is subject to all applicable copyright laws and is not for resale in any manne r.
may 2010 ? 2001 fairchild semiconductor corporation www.fairchildsemi.com FIN1017 rev. 1.0.3 FIN1017 3.3v lvds, 1-bit, high-speed differential driver FIN1017 3.3v lvds, 1-bit, high-speed differential driver features ? greater than 600mbs data rate ? 3.3v power supply operation ? 0.5ns maximum differential pulse skew ? 1.5ns maximum propagation delay ? low power dissipation ? power-off protection ? meets or exceeds the tia/eia-644 lvds standard ? flow-through pinout simplifies pcb layout ? 8-lead soic and us8 packages save space description this single driver is designed for high-speed interconnects utilizing low voltage differential signaling (lvds) technology. the driver translates lvttl signal levels to lvds levels with a typical differential output swing of 350mv, which provides low emi at ultra-low power dissipation even at high frequencies. this device is ideal for high-speed transfer of clock or data. the FIN1017 can be paired with its companion receiver, the fin1018, or with any other lvds receiver. ordering information part number operating temperature range package packing method FIN1017mx -40 to +85c 8-lead small outline integrated circuit (soic), jedec ms-012, 0.150inch narrow tape and reel FIN1017k8x -40 to +85c 8-lead us8, jedec mo-187, variation ca 3.1mm wide tape and reel
? 2001 fairchild semiconductor corporation www.fairchildsemi.com FIN1017 rev. 1.0.3 2 FIN1017 3.3v lvds, 1-bit, high-speed differential driver pin configuration figure 1. soic figure 2. us-8 (top view) ( 1 ) note: 1. ground pins 4 and 5 for optimum performance. pin definitions pin# us-8 pin# soic name description 7 2 d in lvttl data input 2 7 d out+ non-inverting driver output 1 8 d out- inverting driver output 8 1 v cc power supply 4, 5 4 gnd / gnd s ground 3, 6 3, 5, 6 nc no connect function table input outputs d in d out+ d out- low low high high high low open low high
? 2001 fairchild semiconductor corporation www.fairchildsemi.com FIN1017 rev. 1.0.3 3 FIN1017 3.3v lvds, 1-bit, high-speed differential driver absolute maximum ratings stresses exceeding the absolute maximum ratings may dam age the device. the device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. in addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. the absolute maximum ratings are stress ratings only. symbol parameter min. max. unit v cc supply voltage -0.5 +4.6 v d in dc input voltage -0.5 +6.0 v d out dc output voltage -0.5 +4.7 v i osd driver short-circuit current, continuous 10 ma t stg storage temperature range -65 +150 c t j max junction temperature +150 c t l lead temperature (soldering, 10 seconds) +260 c esd human body model, jesd22-a114 6500 v bus pins d out+ /d out- to gnd 10500 machine model, jesd22-a115 350 recommended operating conditions the recommended operating conditions table defines the conditions for actual device operation. recommended operating conditions are specified to ens ure optimal performance to the datasheet specifications. fairchild does not recommend exceeding them or designing to absolute maximum ratings. symbol parameter min. max. unit v cc supply voltage 3.0 3.6 v v in input voltage 0 v cc v t a operating temperature -40 +85 c
? 2001 fairchild semiconductor corporation www.fairchildsemi.com FIN1017 rev. 1.0.3 4 FIN1017 3.3v lvds, 1-bit, high-speed differential driver dc electrical characteristics over-supply voltage and operating temperature ranges, unless ot herwise specified. all typical values are at t a = 25c and with v cc = 3.3v. symbol parameter conditions min. typ. max. units v od output differential voltage r l = 100 , see figure 3 250 350 450 mv v od v od magnitude change from differential low-to-high 25 mv v os offset voltage 1.125 1.250 1.375 v v os offset magnitude change from differential low-to-high 25 mv i off power-off output current v cc = 0v, v out = 0v or 3.6v 20 ma i os short-circuit output current v out = 0v -8 ma v od = 0v 8 v ih input high voltage 2 v cc v v il input low voltage gnd 0.8 v i in input current v in = 0v or v cc 20 ma i i(off) power-off input current v cc = 0v, v in = 0v or 3.6v 20 ma v ik input clamp voltage i ik = -18ma -1.5 v i cc power supply current no load, v in = 0v or v cc 8 ma r l = 100 , v in = 0v or v cc 10 ma c in input capacitance 4 pf c out output capacitance 6 pf ac electrical characteristics over-supply voltage and operating temperature ranges, unless ot herwise specified. all typical values are at t a = 25c and with v cc = 3.3v. symbol parameter test conditions min. max. units t plhd differential propagation delay, low-to-high r l = 100 , c l = 10pf, see figure 4 and figure 5 0.5 1.5 ns t phld differential propagation delay, high-to-low 0.5 1.5 ns t tlhd differential output rise time (20% to 80%) 0.4 1.0 ns t thld differential output fall time (80% to 20%) 0.4 1.0 ns t sk(p) pulse skew |t plh - t phl | 0.5 ns t sk(pp) part-to-part skew (2) 1.0 ns note: 2. t sk(pp) is the magnitude of the difference in propagation del ay times between any specified terminals of two devices switching in the same direction (either low-to-high or high-to-low) when both devices operate with the same supply voltage, same temperature, and have identical test circuits.
? 2001 fairchild semiconductor corporation www.fairchildsemi.com FIN1017 rev. 1.0.3 5 FIN1017 3.3v lvds, 1-bit, high-speed differential driver test diagrams figure 3. differential driver dc test circuit figure 4. differential driver propagation delay and transition time test circuit notes: note a: all input pulses have frequency = 10mhz, t r or t f = 2ns. note b: c l includes all probe and fixture capacitances. figure 5. ac waveforms
? 2001 fairchild semiconductor corporation www.fairchildsemi.com FIN1017 rev. 1.0.3 6 FIN1017 3.3v lvds, 1-bit, high-speed differential driver typical performance characteristics figure 6. output high voltage vs. power supply voltage figure 7. output low voltage vs. power supply voltage figure 8. output short circuit current vs. power supply voltage figure 9. differential output voltage vs. power supply voltage figure 10. differential output voltage vs. load resistor figure 11. offset voltage vs. power supply voltage
? 2001 fairchild semiconductor corporation www.fairchildsemi.com FIN1017 rev. 1.0.3 7 FIN1017 3.3v lvds, 1-bit, high-speed differential driver typical performance characteristics figure 12. power supply current vs. frequency figure 13. power supply current vs. power supply voltage figure 14. power supply current vs. ambient temperature figure 15. differential propagation delay vs. power supply figure 16. differential propagation delay vs. ambient temperature figure 17. differential pulse skew (t plh - t phl ) vs. power supply voltage
? 2001 fairchild semiconductor corporation www.fairchildsemi.com FIN1017 rev. 1.0.3 8 FIN1017 3.3v lvds, 1-bit, high-speed differential driver typical performance characteristics figure 18. differential pulse skew (t plh - t phl ) vs. ambient temperature figure 19. transition time vs. power supply voltage figure 20. transition time vs. ambient temperature
? 2001 fairchild semiconductor corporation www.fairchildsemi.com FIN1017 rev. 1.0.3 9 FIN1017 3.3v lvds, 1-bit, high-speed differential driver physical dimensions 80 see detail a notes: unless otherwise specified a) this package conforms to jedec ms-012, variation aa, issue c, b) all dimensions are in millimeters. c) dimensions do not include mold flash or burrs. d) landpattern standard: soic127p600x175-8m. e) drawing filename: m08arev13 land pattern recommendation seating plane 0.10 c c gage plane x 45 detail a scale: 2:1 pin one indicator 4 8 1 c m ba 0.25 b 5 a 5.60 0.65 1.75 1.27 6.20 5.80 3.81 4.00 3.80 5.00 4.80 (0.33) 1.27 0.510.33 0.25 0.10 1.75 max 0.25 0.19 0.36 0.500.25 r0.10 r0.10 0.90 0.406 (1.04) option a - bevel edge option b - no bevel edge figure 21. 8-lead small outline integrated circuit (soic), jedec ms-012, 0.150inch narrow package drawings are provided as a service to customers considering fairchild components. drawings may change in any manner without notice. please note the revision and/or date on the drawing and contact a fairchild semiconductor representative to ver ify or obtain the most recent revision. package specifications do not expand t he terms of fairchilds worldwide terms and condition s, specifically the warranty therein, which covers fairchild products. always visit fairchild semiconductors online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ .
? 2001 fairchild semiconductor corporation www.fairchildsemi.com FIN1017 rev. 1.0.3 10 FIN1017 3.3v lvds, 1-bit, high-speed differential driver physical dimensions 0.30 typ seating plane 0.10-0.18 0.13 ab c c. dimensions are exclusive of burrs, mold flash, d. dimensions and tolerances per ansi y14.5m, 1982. and tie bar extrusions. mab08arevc 0.50typ b. dimensions are in millimeters. a. conforms to jedec registration mo-187 -c- 0.17-0.27 0.10 0.00 detail a 0-8 0.4 typ -b- 0.700.10 all lead tips 0.2 cba 3.1.1 0.15 pin #1 ident. 0.90 max all lead tips 0.1 c 1.55 8 1 4 2.30.1 5 -a- 0.70 2.70 3.40 1.00 0.5 typ detail a 1.80 gage plane 0.12 figure 22. 8-lead us8, jedec mo-187, variation ca 3.1mm wide package drawings are provided as a service to customers considering fairchild components. drawings may change in any manner without notice. please note the revision and/or date on the drawing and contact a fairchild semiconductor representative to ver ify or obtain the most recent revision. package specifications do not expand t he terms of fairchilds worldwide terms and condition s, specifically the warranty therein, which covers fairchild products. always visit fairchild semiconductors online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ .
? 2001 fairchild semiconductor corporation www.fairchildsemi.com FIN1017 rev. 1.0.3 11 FIN1017 3.3v lvds, 1-bit, high-speed differential driver
www. onsemi.com 1 on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductors product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent ? marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does on semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. typical parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including typic als must be validated for each customer application by customers technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 www.onsemi.com literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your localsales representative ? semiconductor components industries, llc

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